Dear Colleague,
The 6
th International Congress on Environmental Geotechnics (ICEG) will be held in New Delhi next November and I look forward to meeting you or your colleagues there. As you should be aware, the ICEG is a quadrennial event and, following approval by the Board of ISSMGE, its organisation is now the responsibility of Technical Committee 215: Environmental Geotechnics. It is timely that we start to plan for the 7th ICEG. In order to select the host country and the venue, I am asking the members of the Technical Committee along with ISSMGE Member Societies to submit expressions of interest for hosting the 7
In order to select the host country and the venue, I am asking the members of the Technical Committee along with ISSMGE Member Societies to submit expressions of interest for hosting the 7
thICEG in 2014. The submission should be sent to me no later than
The submission should be sent to me no later than
30th September 2010 and should include a short description of proposed city and venue, likely themes and a preliminary budget focusing mainly on the expected number of delegates. The expressions of interest will be considered by the Executive of TC215. Presentations of the proposals will be made during a meeting of the Technical Committee, to be held in New Delhi at the time of the 6ICEG, and a vote will be taken to select the venue of 7ICEG 2014. I look forward to receiving your proposal and I hope to meet numerous delegates of your Member Society at the 6
The expressions of interest will be considered by the Executive of TC215. Presentations of the proposals will be made during a meeting of the Technical Committee, to be held in New Delhi at the time of the 6ICEG, and a vote will be taken to select the venue of 7ICEG 2014.
I look forward to receiving your proposal and I hope to meet numerous delegates of your Member Society at the 6
thICEG. With my best wishes, Mario Manassero (TC215 Chairman) 7ICEG_Application_Submission.pdf (143.33 kB)
With my best wishes,
Mario Manassero
(TC215 Chairman) 7ICEG_Application_Submission.pdf (143.33 kB)